مقدمة
SnAg0.3Cu0.7 lead-free solder bar is a low-silver ternary alloy lead-free welding material. Characterized by excellent wettability, bright solder joints, superior oxidation resistance, and good comprehensive solder joint performance, it is widely used in PCB assembly processes such as wave soldering and dip soldering for electronics, instruments, aerospace equipment, and home appliances.
| Production Name | Lead Free Solder Bar |
|---|---|
| التركيب | SnAg0.3Cu0.7 |
| نقطة الانصهار | 217-227℃ |
| الكثافة | 7.40 g/cm³ |
| رقم الموديل | KWLF-SAC0307 |
| المواد | Tin/Copper/Silver |
| الشهادة | ISO9001/RoHs/REACH |
| الحزمة | 20 kg/box |
التدفق الأمثل وخصائص الترطيب
صديقة للبيئة
