مقدمة
Adding silver to leaded solder paste can significantly improve its fluidity, enhance soldering reliability, and greatly optimize the low-impedance performance of solder joints after welding. Today, KEWEI factory introduces a moderately priced lead solder paste with good soldering performance: metal composition – Sn62.8/Pb36.8/Ag0.4.
Developed for the evolving SMT rapid chip soldering process, this no-clean solder paste exhibits minimal residue after welding, with the residues offering high insulation impedance performance. It fully meets the no-clean requirements of SMT chip mounting processes in electronics factories.
| اسم المنتج | معجون اللحام |
|---|---|
| رقم الموديل | KWSP-628 |
| نقطة الانصهار | 179-183℃ |
| Particle Size | 20-38 μm |
| Flux Type | ROL0 |
| التركيب | Sn62.8Pb36.8Ag0.4 |
| محتوى التدفق | 10±0.5 |
| Viscosity | 170±30 |
| مدة الصلاحية | 6-12 Months (0-10℃) |
