Kewei Solder Paste Sn62.8Pb36.8Ag0.4 with 183C Melting Point

Lead Solder Paste Sn62.8Pb36.8Ag0.4

Consistent Quality: Benefit from consistent, high-quality solder paste that ensures reliable connections and optimal performance across various electronic applications.
Custom Formulations: Access tailored solder paste formulations to meet specific application needs, enhancing efficiency and effectiveness in your manufacturing processes.
Technical Expertise: Leverage the technical expertise and support from a seasoned manufacturer, ensuring you have the guidance needed for complex soldering challenges.
Competitive Pricing: Enjoy competitive pricing strategies that help reduce costs while maintaining superior product standards, maximizing your return on investment.

Introduction

Adding silver to leaded solder paste can significantly improve its fluidity, enhance soldering reliability, and greatly optimize the low-impedance performance of solder joints after welding. Today, KEWEI factory introduces a moderately priced lead solder paste with good soldering performance: metal composition – Sn62.8/Pb36.8/Ag0.4.
Developed for the evolving SMT rapid chip soldering process, this no-clean solder paste exhibits minimal residue after welding, with the residues offering high insulation impedance performance. It fully meets the no-clean requirements of SMT chip mounting processes in electronics factories.

Product Name	Solder Paste
Model No.	KWSP-628
Melting Point	179-183℃
Particle Size	20-38 μm
Flux Type	ROL0
Composition	Sn62.8Pb36.8Ag0.4
Flux Content	10±0.5
Viscosity	170±30
Shelf Life	6-12 Months (0-10℃)