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Lead-free Solder Paste SAC305

High-Quality Composition: Our solder paste is formulated with a precise mix of metal alloys and flux, ensuring superior conductivity and strong, reliable bonds.
Excellent Wetting Ability: The solder paste provides excellent wetting, allowing for smooth and even solder flow, creating clean, durable joints.
Low Residue: Designed to leave minimal residue after soldering, reducing the need for post-solder cleaning and ensuring a clean finish.
Lead-Free Options: We offer lead-free solder paste that complies with RoHS standards, making it suitable for environmentally conscious applications.
Wide Application Range: Suitable for SMT (Surface Mount Technology), BGA (Ball Grid Array), and various PCB assembly processes, delivering consistent performance across different environments.

Introduction

Sn96.5%Ag3%Cu0.5% solder paste is widely used in PCB, BGA, CSP and welding repair. We have 2 types as low halogen and halogen free. Can reach industry standards. With oxide layer for rapid removal of metal surface, components and storn metal bonding performance, Non-conductive insulation, fast wetting, less smoke, less residue. We also produce many models such as high temperature solder paste, low temperature solder paste, middle temperature solder paste, solder paste flux,
Tin lead solder paste, Sn63Pb37, Sn60Pb40, Sn50Pb50, Sn62.8Ag0.4Pb36.8, Sn62.9/Pb36.9/Ag0.2, lead free solder paste, low halogen solder paste and halogen free solder paste, solder paste flux.
It is widely used for these: Laptop ,computer,mobile phone,home Appliances for LED, SMT, SMD, PCB industry ect.

Brand	KEWEI
Product Name	Lead free solder paste
Model	KWSP-SAC305
Composition	Sn99% Ag0.3% Cu0.7%
Application	SMT Soldering
Melting Point	217~227℃
Weight	500g/jar
Shelf life	0~10℃ 6 months
Certificate	REACH RoHS SGS, ISO9001