Premium Solder Paste from Solder Manufacturer | Lead Free, High Temp, ROHS Certificate

Lead-free Solder Paste SAC0307

Superior alloy composition with good mechanical and electrical properties.
Excellent wettability for even and thorough solder joint formation.
Low residue, non-corrosive and non-conductive residues, reducing post-cleaning needs.
High melting stability for optimal solder joint formation under controlled thermal conditions.
Compatible with multiple manufacturing processes like SMT, through-hole, and reflow soldering for efficient assembly.

Introduction

Lead Free Solder Paste SAC0307

KWSP-0307 Sn99Ag0.3Cu0.7 solder paste is a lead-free, halogen-free and no-clean type of solder paste. Comply with industry standards and have RoHS and REACH certificates.
This solder paste has the remarkable characteristics of rapidly removal of oxide layer on metal surface, strong bonding between components and metals, non-conductive insulation, fast wetting speed, less smoke and less residue.
Widely applied in various fields, laptops, computers, mobile phones, home appliances, LEDs, SMT, SMD, PCB, BGA, CSP and welding repair, etc.

BRAND	KEWEI
Product Name	Lead free solder paste
Model	KWSP-SAC0307
Composition	Sn99Ag0.3Cu0.7
Application	PCB,SMT assembly
Melting Point	217~227℃
Weight	500g/jar
Shelf Life	6~12 months (0~10℃)
Certificate	REACH RoHS SGS, ISO9001