Introduction
Lead solder paste Sn62Pb36Ag2 is a specialized type of solder paste used in electronics assembly. Please check its detailed characteristics and typical uses:
- Composition Details:
- Tin (Sn) – 62%: Provides good wetting properties and lowers the melting point of the solder, making it easier to work with.
- Lead (Pb) – 36%: Contributes to the paste’s malleability and strength, ensuring durable joints.
- Silver (Ag) – 2%: Enhances mechanical strength and thermal and electrical conductivity, improving the overall reliability of the soldered joint.
- Melting Point: The presence of silver slightly raises the melting point compared to standard lead-tin solders but offers enhanced joint properties. The melting point is generally around 179°C (354°F).
- Applications: This type of solder paste is commonly used in applications where increased mechanical strength and thermal fatigue resistance are required. It’s particularly suitable for high-reliability electronics, such as aerospace, automotive, and telecommunications.
| Item | Detail |
|---|---|
| Product | Lead Solder Paste Sn62Pb36Ag2 |
| Composition | Sn62%Pb36%Ag2% |
| Packing | 500g/bottle, 20 bottles/carton |
| Application | USB Connector, PCB/SMT, high-precision instruments, electronics |
| Feature | Good wettability, no residue |
| Material | Alloy Tin Powder 90%+Flux 10% |
| Powder size | Type 3, Type 4, Type 5 |
