High-Quality Composition: Our solder paste is formulated with a precise mix of metal alloys and flux, ensuring superior conductivity and strong, reliable bonds.
Excellent Wetting Ability: The solder paste provides excellent wetting, allowing for smooth and even solder flow, creating clean, durable joints.
Low Residue: Designed to leave minimal residue after soldering, reducing the need for post-solder cleaning and ensuring a clean finish.
Lead-Free Options: We offer lead-free solder paste that complies with RoHS standards, making it suitable for environmentally conscious applications.
Wide Application Range: Suitable for SMT (Surface Mount Technology), BGA (Ball Grid Array), and various PCB assembly processes, delivering consistent performance across different environments.
